EMI/RFI Gaskets

Automated Form In Place Elastomer EMI/RFI Gaskets

Parker Chomerics LogoChomerics’ automated CHOFORM® technology dispenses form-in-place conductive elastomer gaskets on metal or plastic housings. The system applies programmed gasket beads with exceptional accuracy in three full axes, compensating for uneven surfaces in castings and molded parts to provide consistent, highly reliable seals. Gaskets can be applied on flanges as narrow as .030 inch (0.76 mm), affording more space for board components or allowing smaller overall packaging. CHOFORM® EMI/RFI gaskets cure in minutes and provide more than 75 dB attenuation from 200 MHz to 10 GHz.

ParPHorm S1936, S1945, L1938 (non-conductive) Form-in-Place Sealing Compounds

ParPHorm is a family of non-conductive, thermal cure, form-in-place, elastomeric sealing compounds. These silicone and fluorosilicone materials provide environmental, fluid, and dust sealing of small enclosures. The product line consists of state-of-the art compounds designed to be robotically dispensed onto small housings and then thermally cured. Curing of the dispensed materials is done via in-line ovens at 230°F for 40 minutes. Dispensed bead heights range from 0.018 in. (0.46 mm) to 0.13 in. (3.94 mm). Application advantages of the materials are resistant to a wide variety of fluids, excellent substrate adhesion, low hardness, and outstanding compression set properties.

Conductive Elastomer EMI/RFI Gaskets

Foam-Based EMI/RFI Gaskets

Metal EMI/RFI Gaskets

Wire Mesh EMI/RFI Gaskets