Therm A Gap 174,274 and 574 Thermal Gap Fillers

THERM-A-GAPâ„¢ 174, 274, and 574

THERM-A-GAP thermal interface materials fill air gaps between hot components and heat sinks or metal chassis. Their flexible, elastic nature allows them to blanket highly uneven surfaces. Heat is conducted away from separate components or entire PCBs into metal covers, frames or spreader plates.

THERM-A-GAP A174 materials are suited for high volume, low cost applications, such as in automotive electronics, laptop PCs,etc.

THERM-A-GAP A274 materials can be molded to meet exact dimensions required for optimum electronics packaging.

THERM-A-GAP A574 materials are ideal for heat flux typical of microprocessors, video chips and power semiconductors.

“Clean-Break” option available for 174 and 547 THERM-A-GAP materials. See product data sheet for G174 and G574.

Typical Applications

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