Thermal Interface Products

Form In Place Gap Fillers

THERM-A-GAP™ Gel T630, T630G, T635, & T636 – Fully Cured Thermally Conductive Form-in-Place Gap Fillers are Chomerics’ latest development in thermally conductive gap fillers. These unique thermal interface materials are ideal for applications where typical gap filling pads cause too much stress on component solder joints and leads, resulting in damage to the printed circuit board. These gels are highly conformable, one component pre-cured silicone that can be dispensed to fill large and uneven gaps in electronics assemblies. The visco-elastic paste is a form stable, fully cured silicone material that takes little to no compressive force to deform during assembly. The “G” versions contain 0.010” glass beads, used for a compression stop for applications requiring electrical isolation. All products have low extractable silicone levels and pass the Bellcore silicone extractable specification for the telecom industry.

Heat Spreaders

T-Wing® and C-Wingâ„¢ heat spreaders provide a low-cost, effective means of cooling IC devices in restricted spaces where conventional heat sinks aren’t appropriate. They typically provide junction temperature reduction of 20° C when applied on microprocessors and cache chips in laptop PCs and other high density, handheld electronics, and on disk drives. They are easily added by peel and stick application. T-Wing heat spreaders use copper as a thermal conductor. They conform to non-flat surfaces for optimal thermal and mechanical performance. C-Wing heat spreaders are ceramic, electrically non-conductive cooling solutions where localized sensitivity to EMI (electromagnetic interference) may be an issue.

Thermal Grease

T660 High Performance Thermal Grease Chomerics T660 (patent pending) is an innovative new approach to enhancing the performance of thermal grease. This thermal phase-change grease has been developed to meet the need for high power applications requiring a material with minimum bond line thickness and high conductivity. T660 is a non-curing, dispensable, highly conformable material which requires no cure cycle or mixing and dispenses to fill highly variable package tolerances. T660 grease contains small, performance enhancing conductive particles that melt at 62ºC, resulting in a minimal bond line and high thermal conduction. The material is thermally stable and requires virtually no compressive force to deform under assembly pressure. Simply dispense the grease onto your component, assemble the heat sink or chassis over the material, and ship your product. The combination of minimal pressure and the melting of these particles create the proper environment for the grease to obtain a thin interface and the highest thermal conduction.

T650 General Duty Thermal Grease Chomerics T650 is a thermal grease created to efficiently conduct heat and fill the voids between hot components and heat sinks. T-650 is a non-curing, dispensable, highly conformable material which requires no cure cycle or mixing and dispenses to fill highly variable tolerances in electronics assemblies. The material is thermally stable. It requires virtually no compressive force to deform under assembly pressure leaving solder joints and leads stress free. Simply dispense the grease onto your component, assemble the heat sink or chassis over the material, and ship your product. This material is ideal for rework and field repair situations. T650 requires no refrigeration, stores at room temperature and has no filler settling issues. The material is a one component compound, is easy to dispense, and has an indefinite shelf life.

Phase-Change Thermal Interface Materials

Typical Applications for Thermal Interface Materials Include: