Thermflow T710 Phase Change Material

THERMFLOW® T710 Phase-Change Material

THERMFLOW® T710 phase-change thermal interface material combines the consistency and ease of use of elastomeric pads with the low thermal impedance of thermal grease. This low thermal resistance path maximizes heat sink performance and improves the reliability of microprocessors, memory modules, DC/DC converters and power modules. For microprocessors and power ICs, which are typically attached to heat, sinks with spring clips – Recommended for pressure range of 5 to 50 psi. PSA versions allow “peel and stick” installation.

Typical Applications

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