Thermflow T725 Phase Change Material

THERMFLOW® T725 Phase-Change Material

THERMFLOW® T725 phase-change thermal interface material combines the consistency and ease of use of elastomeric pads with the low thermal impedance of thermal grease. This low thermal resistance path maximizes heat sink performance and improves the reliability of microprocessors, memory modules, DC/DC converters and power modules. For high power microprocessors (>50 watt dissipation), DC/DC converters, IGBTs and other power modules – Recommended for pressure range of 5 to 50 psi.

Typical Applications

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