Laminates of metal foil and dielectric film provide shielding and grounding improvements over conductive coatings and both board and enclosure levels. When properly grounded, a laminate's foil layer provides a 10-60dB of EMI shielding at 1 MHz-1 GHz, equaling or surpassing the shielding performance provided by conductive coatings. The film layers provide insulation, scratch and puncture resistance, flame resistance and flexibility. Laminate shields and ground planes can include die-cut shapes, edges and holes for custom fitting intricate applications. Scoring provides extensive options, including six-sided enclosure shapes. Chromerics laminates typically feature specific areas of exposed foil that can be used as integral grounding tabs for component grounding.

Fabrication & Customer Service
As a factory authorized value-added fabricator of Chromerics products, El-Com/Cabletek provides all of the services necessary to ensure a smooth and trouble-free interface between your design, purchasing personnel, and Chromerics' shielding products.

Inventory
El-Com/Cabletek maintains an in-depth inventory of standard Chromerics shielding products. Samples are available.

THERMFLOW is a phase-change thermal material specially formulated for use with high performance microprocessors and other hot devices requiring minimum thermal resistance for maximum heat sink performance and component reliability. THERMFLOW softens at device operating temperature to conform to irregular surfaces under low pressure, combining the consistency and ease of use of elastomeric pads with the low thermal impedance of thermal grease, but with mimimum migration. Product line also includes special unsupported free films that can yield very thin bond lines of 0.005.

Typical Applications: Power Conversion, BGA Packages, and Information Technology.
Applications include micro-processers, DC/DC converters, memory modules, and power ICs.

Fabrication
El-Com/Cabletek has complete in-house fabrication capability to fabricate:
• Die-cut gaskets
• Conductive O-rings
• Kiss-cut and perforated laminates
• Combo gaskets and strips
• EMI/RFI vents

Sales support
We provide fast sample ordering processing, quick turnaround of production orders, and consistent JIT deliveries.

Value-added technical support
Special designs are available to meet your custom shielding needs.

THERM-A-GAP elastomers are used to fill air gaps between components or PC boards and heat sinks or metal chassis to enhance heat transfer. The flexible, elastic nature of these interface pads conform easily to surface irregularities. High thermal conductivity and exceptional conformability of the THERM-A-GAP family of materials enables them to blanket highly uneven surfaces, transferring heat away from from individual components or entire PCB's into heat sinks, metal covers, frames, or spreader plates, and allowing chassis parts to be used as heat spreaders where space is restricted. One-piece thermal interface materials provide electrical isolation and offer minimum resistance to heat flow, permitting heat generated by semiconductor devices to be removed to the ambient environment and ensure reliable operation of the devices.

Typical Applications: Power Conversion, BGA Packages, and Information Technology.
Applications include electronics packaging, automotive electronics, power semiconductors, video chips, microprocessors, and laptop PCs.